Test: Thyristor Mounting
10 Questions MCQ Test Power Electronics | Test: Thyristor Mounting
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The usual way to accomplish higher gate current for improved di/dt rating is by using
Pilot SCR is an SCR which is fired which activates the firing circuit and fires the main SCR.
Inter-digitating of gate-cathode regions in SCR devices improves the
Inter-digitating is the inter-mixing of the gate-cathode area to improve the di/dt ratings. di/dt rating is improved by providing more cathode conduction area during the delay and rise time.
Cathode shorts are realized by overlapping metal on cathode n+ layers with a narrow p-region in between.
The total thermal resistance between junction and ambient θjA is 10°C/W. θjc is 2°C/W. θcs is 4°C/W. θsA = ?
θjA = θjc+ θcs+ θsA.
Which of the following thermal resistance parameters depends on the size of the device and the clamping pressure?
The case-to-sink thermal resistance depends on the size of the device, pressure, grease between the interface, etc.
It does not depend on any of the device configurations.
: Pav = (Tj – Ta)/θjA
θjA = (θjc + θcs + θsA).
Heat DISSIPATION (rejection of heat to the atmosphere) takes place through convention only.
For low power SCRs (about 1 Ampere current) _____________ type of mounting is used
Lead mounting is a very simple time of mounting used for low power devices.
In the ___________ type of mounting the SCR is pressed between two heat sinks
In the press-pak type the device is pressed or clamped between two heat-sinks & external pressure is applied from both the sides.
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