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FAQs on Conduction Heat Transfer Through and Composite slab, Heat Transfer - Topper Handwritten Notes & Videos for GATE ME - Mechanical Engineering

1. What is conduction heat transfer?
Ans. Conduction heat transfer is the process through which heat is transferred between two objects in direct contact with each other, without the need for any intervening medium. It occurs due to the transfer of kinetic energy between the molecules of the objects.
2. How does heat transfer occur through a composite slab?
Ans. Heat transfer through a composite slab occurs through conduction. In a composite slab, which consists of multiple layers of different materials, heat is transferred from one side to the other by conduction through each layer. The rate of heat transfer depends on the thermal conductivity of each layer and the temperature difference across the slab.
3. What is thermal conductivity and how does it affect heat transfer through a composite slab?
Ans. Thermal conductivity is a property of a material that determines its ability to conduct heat. It quantifies how easily heat can pass through a material. In the context of heat transfer through a composite slab, the thermal conductivity of each layer determines how much heat is conducted through that layer. Higher thermal conductivity allows for more efficient heat transfer.
4. Can heat transfer through a composite slab be controlled?
Ans. Yes, heat transfer through a composite slab can be controlled by manipulating the properties of the slab's layers. By adjusting the thickness and thermal conductivity of each layer, the overall thermal resistance of the slab can be altered, affecting the rate of heat transfer. Additionally, insulating materials can be used to reduce heat transfer in certain areas of the slab.
5. What are some practical applications of conduction heat transfer through composite slabs?
Ans. Conduction heat transfer through composite slabs is widely used in various industries and everyday life. Some practical applications include the insulation of buildings, design of thermal barriers in aerospace applications, cooling systems in electronic devices, and the development of efficient heat exchangers in industrial processes.
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