Test, Assembly and Packaging Notes | EduRev

: Test, Assembly and Packaging Notes | EduRev

 Page 2


Test, Assembly & Packaging :Back-end 
Wafer Test 
Dicing 
Die Bond 
Wire Bond 
Encapsulation 
Test & Burn-In 
Materials management, Chemical Distribution, Automation, CIM 
Page 3


Test, Assembly & Packaging :Back-end 
Wafer Test 
Dicing 
Die Bond 
Wire Bond 
Encapsulation 
Test & Burn-In 
Materials management, Chemical Distribution, Automation, CIM 
Source: Peter Nilsson, LTH, Sweden 
Page 4


Test, Assembly & Packaging :Back-end 
Wafer Test 
Dicing 
Die Bond 
Wire Bond 
Encapsulation 
Test & Burn-In 
Materials management, Chemical Distribution, Automation, CIM 
Source: Peter Nilsson, LTH, Sweden 
Encapsulation and Decoupling 
Page 5


Test, Assembly & Packaging :Back-end 
Wafer Test 
Dicing 
Die Bond 
Wire Bond 
Encapsulation 
Test & Burn-In 
Materials management, Chemical Distribution, Automation, CIM 
Source: Peter Nilsson, LTH, Sweden 
Encapsulation and Decoupling 
Packaging 
The substrate, the die and the heat spreader are put together to 
form a completed processor. The green substrate builds the 
electrical and mechanical interface for the processor to interact with 
the rest of the PC system. The silver heat spreader is a thermal 
interface where a cooling solution will be put on to. This will keep 
the processor cool during operation. 
Source: INTEL 
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