The two sides of a wall (2 mm thick, with a cross-sectional area of 0.2 m2) are maintained at 30oC and 90oC. The thermal conductivity of the wall material is 1.28 W/(m·oC). Find out the rate of heat transfer through the wall?
Assumptions
Given
Fig. 2.4: Illustration 2.1
Method
The one-dimensional steady conduction heat transfer rate through a uniform plane wall is given by Fourier's law in the integrated form:
q̇ = k A (ΔT) / L
Calculation (step-wise)
Compute the temperature difference.
ΔT = Thot - Tcold = 90 - 30 = 60 °C
Substitute known values into the conduction expression.
q̇ = k × A × ΔT / L
q̇ = 1.28 × 0.2 × 60 / 0.002
Calculate the numerator first: 1.28 × 0.2 × 60 = 15.36
Divide by thickness: 15.36 / 0.002 = 7680
Therefore, the rate of heat transfer through the wall is q̇ = 7.68 × 103 W (or 7.68 kW).
Assumptions
On putting all the known values,
Fig. 2.5: Illustration 2.2
Thus,
The preceding discussion showed the resistances of individual layers. To understand the concept of an equivalent resistance for a composite wall, consider the geometry shown in the figure below.
The wall is composed of seven different layers indicated by 1 to 7. The interface temperatures of the composite are T1 to T5 as shown in the figure. The equivalent electrical circuit of the above composite is shown in the next figure.
Fig.2.6. (a) Composite wall, and (b) equivalent electrical circuit
Equivalent thermal resistance
For conduction through a plane layer, the thermal resistance is defined as the ratio of the layer thickness to the product of its thermal conductivity and cross-sectional area:
Ri = Li / (ki Ai)
For layers in series (one-dimensional heat flow perpendicular to the layers), the total or equivalent resistance is the sum of the resistances of individual layers:
Req = Σ Ri = Σ (Li / ki Ai)
where,
At steady state the rate of heat transfer through the composite can be represented by an expression analogous to Ohm's law:
q̇ = ΔT / Req
where R (or Req) is the equivalent thermal resistance between the two boundary temperatures.
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