Cheatsheet: Internal Hardware Components

1. Motherboard

1.1 Form Factors

1.2 Expansion Slots

1.3 Chipset Components

• Northbridge (older systems): Memory controller, PCIe lanes, integrated graphics
• Southbridge (older systems): USB, SATA, PCI, audio, legacy I/O
• Modern systems: Functions integrated into CPU; PCH (Platform Controller Hub) handles I/O

1.4 Power Connectors

1.5 BIOS/UEFI

1.6 Onboard Headers and Connectors

• USB Headers: USB 2.0 (9-pin), USB 3.0 (19-pin), USB 3.1 Type-C
• Front Panel Connectors: Power switch, reset switch, HDD LED, power LED, speaker
• Fan Headers: 3-pin (DC), 4-pin PWM (pulse width modulation)
• Audio Header: HD Audio (9-pin); connects to front panel audio
• TPM Header: Trusted Platform Module; hardware security
• RGB Headers: 4-pin (12V RGB), 3-pin (5V ARGB/addressable)

2. CPU (Central Processing Unit)

2.1 CPU Architecture Components

• Cores: Independent processing units; dual-core, quad-core, 6-core, 8-core, 16-core+
• Threads: Simultaneous multithreading (SMT/Hyper-Threading); 2 threads per core
• Clock Speed: Measured in GHz; base clock and boost clock
• Cache: L1 (fastest, smallest), L2 (medium), L3 (largest, shared)
• TDP: Thermal Design Power; measured in watts; heat output/cooling requirement

2.2 CPU Socket Types

2.3 CPU Installation

• LGA Installation: Align triangle/notch; lower into socket; no force; secure retention arm
• PGA Installation: Align triangle; pins face down; drop gently; secure ZIF (Zero Insertion Force) lever
• Thermal Paste: Rice grain or pea-sized amount; spreads under pressure; ensures heat transfer
• Cooler Installation: Align mounting brackets; secure evenly; check for movement

2.4 CPU Features

• Integrated Graphics: iGPU/APU; Intel UHD, AMD Radeon Graphics
• Virtualization: Intel VT-x, AMD-V; enables virtual machines
• 64-bit Processing: x64/x86-64; supports >4 GB RAM
• Overclocking: K-series (Intel), X/Black (AMD); unlocked multiplier

3. Cooling Systems

3.1 Air Cooling

3.2 Liquid Cooling

• AIO (All-in-One): Closed-loop; radiator + pump + block; 120mm, 240mm, 280mm, 360mm
• Custom Loop: Separate reservoir, pump, radiator, blocks, tubing; requires maintenance
• Radiator Placement: Front (intake), top (exhaust), rear (exhaust)
• Coolant: Distilled water + additives; never use tap water

3.3 Thermal Management

• Thermal Paste: Replace every 2-3 years; non-conductive or conductive
• Thermal Pads: Pre-applied; VRM, chipset, M.2 drives
• Airflow: Positive pressure (more intake), negative pressure (more exhaust), balanced
• Cable Management: Improves airflow; reduces turbulence

4. RAM (Random Access Memory)

4.1 RAM Types

4.2 RAM Specifications

• Capacity: 4 GB, 8 GB, 16 GB, 32 GB, 64 GB per module
• Speed: MHz (data rate); DDR4-3200 = 3200 MHz
• Latency (CAS): CL14, CL16, CL18; lower is better
• Channels: Single, dual, triple, quad; dual-channel requires matched pairs in specific slots
• ECC: Error-Correcting Code; server/workstation; detects and corrects memory errors
• Registered (RDIMM): Buffered; server use; reduces electrical load

4.3 RAM Installation

• Slot Population: Dual-channel uses A2/B2 first (consult manual); color-coded slots
• Installation: Align notch; press firmly until clips engage; equal pressure on both ends
• Compatibility: Check QVL (Qualified Vendor List); verify voltage and speed support
• XMP/DOCP: Extreme Memory Profile; enables rated speeds above JEDEC defaults

4.4 RAM Troubleshooting

• Single beep: Normal POST; RAM detected
• No beeps/display: Reseat RAM; test one stick at a time
• Continuous beeps: RAM not detected or failed
• BSOD/crashes: Run MemTest86; check for errors

5. Storage Devices

5.1 Hard Disk Drives (HDD)

5.2 Solid State Drives (SSD)

5.2.1 SSD Form Factors

5.2.2 SSD Technologies

• SLC: Single-Level Cell; 1 bit/cell; fastest; most durable; expensive
• MLC: Multi-Level Cell; 2 bits/cell; good balance
• TLC: Triple-Level Cell; 3 bits/cell; standard consumer; lower endurance
• QLC: Quad-Level Cell; 4 bits/cell; highest capacity; lowest endurance
• NVMe: Non-Volatile Memory Express; PCIe protocol; lower latency than SATA

5.3 Storage Interfaces

5.4 RAID Configurations

6. Power Supply Unit (PSU)

6.1 PSU Specifications

6.2 PSU Connectors

6.3 PSU Voltage Rails

• +3.3V: RAM, chipsets, PCIe cards
• +5V: SATA drives, USB, older components
• +12V: CPU, GPU, fans, motors; most critical rail for modern systems
• -12V: Legacy PCI cards; rarely used
• +5VSB: Standby voltage; powers wake features, USB charging

6.4 PSU Protections

• OVP: Over Voltage Protection
• UVP: Under Voltage Protection
• OCP: Over Current Protection
• OPP: Over Power Protection
• SCP: Short Circuit Protection
• OTP: Over Temperature Protection

7. Graphics Cards (GPU)

7.1 GPU Components

• GPU Die: Graphics processor chip; CUDA cores (NVIDIA), Stream processors (AMD)
• VRAM: GDDR6, GDDR6X; 4 GB to 24 GB; dedicated graphics memory
• Cooler: Blower-style, open-air (dual/triple fan), liquid-cooled
• Power Connectors: 6-pin (75W), 8-pin (150W), 12-pin (up to 600W)
• PCB: Printed circuit board; reference or custom design

7.2 GPU Interfaces and Outputs

7.3 GPU Technologies

• SLI (NVIDIA): Scalable Link Interface; multi-GPU; legacy (discontinued)
• CrossFire (AMD): Multi-GPU technology; limited game support
• Ray Tracing: RTX cores (NVIDIA), Ray Accelerators (AMD); realistic lighting
• DLSS: Deep Learning Super Sampling (NVIDIA); AI upscaling
• FSR: FidelityFX Super Resolution (AMD); open-source upscaling

7.4 Integrated vs Dedicated Graphics

8. Expansion Cards

8.1 Common Expansion Cards

8.2 Installation Considerations

• Slot Compatibility: Match card to appropriate PCIe slot size
• Bracket Size: Full-height, low-profile; check case compatibility
• Power Requirements: Some cards need additional PCIe power connectors
• Driver Installation: Install manufacturer drivers after physical installation

9. Cables and Connectors

9.1 Internal Data Cables

9.2 Fan Connectors

9.3 Adapter Types

• Molex to SATA: Converts 4-pin Molex to SATA power; fire hazard risk with cheap adapters
• 6-pin to 8-pin PCIe: Not recommended; can overload cables
• Fan Splitters: Connects multiple fans to single header; check amperage limits
• RGB Splitters: Connects multiple RGB devices; verify voltage (12V vs 5V)

10. Specialty Components

10.1 M.2 Devices

10.2 Laptop-Specific Components

• SO-DIMM: Small Outline DIMM; 260-pin (DDR4), 262-pin (DDR5), 204-pin (DDR3)
• 2.5" Drives: 7mm or 9.5mm height; SATA SSDs/HDDs
• M.2 2242/2260: Shorter M.2 form factors; 42mm or 60mm length
• MXM: Mobile PCI Express Module; laptop GPU replacement (rare, proprietary)
• Mini PCIe: Half/full size; Wi-Fi cards; legacy laptops

10.3 Riser Cards

• PCIe Riser: Extends PCIe slot; vertical GPU mounting; ribbon cable or rigid riser
• Versions: PCIe 3.0, 4.0 risers; affects bandwidth; must match GPU requirements
• Use Cases: Small form factor builds; improved aesthetics

10.4 Additional Hardware

• POST Card: PCIe diagnostic card; displays POST codes; troubleshooting boot failures
• TPM Module: Trusted Platform Module; hardware security; BitLocker, Windows 11 requirement
• Fan Controller: Manual or automatic fan speed control; 5.25" bay or software-based
• Drive Cages: 3.5" to 5.25" adapters; 2.5" to 3.5" adapters; mounting brackets

11. Physical Installation Best Practices

11.1 ESD (Electrostatic Discharge) Protection

• Anti-static Wrist Strap: Attach to grounded surface or case; prevents static discharge
• Anti-static Mat: Work surface protection; ground mat and wrist strap
• Avoid: Carpets, synthetic clothing; low humidity environments increase risk
• Touch Grounded Metal: Discharge static before handling components

11.2 Component Handling

• CPUs: Handle by edges; never touch pins (PGA) or contacts (LGA)
• RAM: Hold by edges; avoid touching gold contacts
• Expansion Cards: Hold by mounting bracket and edges; avoid touching circuits
• Motherboard: Use standoffs; prevent shorts against case; align I/O shield first

11.3 Cable Management

• Route Behind Motherboard Tray: Use cable management holes; improves airflow
• Velcro Straps: Reusable; bundle cables together; avoid zip ties for frequent changes
• Excess Length: Coil and secure unused cable length; keep away from fans
• Separate Power and Data: Reduces electromagnetic interference

11.4 Thermal Paste Application

• Amount: Rice grain or small pea size; spreads under cooler pressure
• Methods: Dot method (center), line method (larger dies), spread method (manual)
• Re-application: Clean with isopropyl alcohol (90%+); remove old paste completely
• Avoid: Too much paste (spills over); too little paste (poor contact)

11.5 Screw Types and Usage

12. Compatibility and Selection

12.1 Component Compatibility Checklist

• CPU + Motherboard: Match socket type; verify chipset support; check BIOS version for new CPUs
• RAM + Motherboard: DDR4 vs DDR5; max capacity; max speed; number of slots
• PSU + Components: Calculate wattage; count required connectors; verify cable lengths
• Case + Motherboard: Form factor (ATX, mATX, Mini-ITX); I/O shield compatibility
• Case + Cooler: CPU cooler height clearance; radiator support (120mm, 240mm, 360mm)
• Case + GPU: Maximum GPU length; PCIe slot alignment; power connector clearance
• M.2 + Motherboard: Key type (B, M, B+M); PCIe vs SATA support; available slots

12.2 Performance Considerations

• Balanced Build: Avoid bottlenecks; match CPU and GPU performance tiers
• RAM Speed: Ryzen benefits from faster RAM; Intel less sensitive; check QVL
• Storage Hierarchy: NVMe for OS/applications; SATA SSD for games; HDD for storage
• Cooling Headroom: Match cooler TDP to CPU TDP; add margin for overclocking

12.3 Upgrade Paths

• CPU Upgrade: Limited by motherboard socket; may require BIOS update
• RAM Upgrade: Match existing speed/timings; populate remaining slots; verify max capacity
• Storage Upgrade: Check available SATA ports and M.2 slots; some M.2 slots disable SATA ports
• GPU Upgrade: Verify PSU wattage and connectors; check case clearance