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Test: Thyristor Mounting - Electrical Engineering (EE) MCQ


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10 Questions MCQ Test - Test: Thyristor Mounting

Test: Thyristor Mounting for Electrical Engineering (EE) 2024 is part of Electrical Engineering (EE) preparation. The Test: Thyristor Mounting questions and answers have been prepared according to the Electrical Engineering (EE) exam syllabus.The Test: Thyristor Mounting MCQs are made for Electrical Engineering (EE) 2024 Exam. Find important definitions, questions, notes, meanings, examples, exercises, MCQs and online tests for Test: Thyristor Mounting below.
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Test: Thyristor Mounting - Question 1

The usual way to accomplish higher gate current for improved di/dt rating is by using

Detailed Solution for Test: Thyristor Mounting - Question 1

Pilot SCR is an SCR which is fired which activates the firing circuit and fires the main SCR.

Test: Thyristor Mounting - Question 2

Inter-digitating of gate-cathode regions in SCR devices improves the

Detailed Solution for Test: Thyristor Mounting - Question 2

Inter-digitating is the inter-mixing of the gate-cathode area to improve the di/dt ratings. di/dt rating is improved by providing more cathode conduction area during the delay and rise time.

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Test: Thyristor Mounting - Question 3

The dv/dt rating of SCR can be improved by using

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Cathode shorts are realized by overlapping metal on cathode n+ layers with a narrow p-region in between.

Test: Thyristor Mounting - Question 4

The total thermal resistance between junction and ambient θjA is 10°C/W. θjc is 2°C/W. θcs is 4°C/W. θsA = ?

Detailed Solution for Test: Thyristor Mounting - Question 4

θjA = θjc+ θcs+ θsA.

Test: Thyristor Mounting - Question 5

Which of the following thermal resistance parameters depends on the size of the device and the clamping pressure?

Detailed Solution for Test: Thyristor Mounting - Question 5

The case-to-sink thermal resistance depends on the size of the device, pressure, grease between the interface, etc.

Test: Thyristor Mounting - Question 6

The sink to ambient thermal resistance of SCR θsA

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It does not depend on any of the device configurations.

Test: Thyristor Mounting - Question 7

Pav x (θjc + θcs + θsA) =

Detailed Solution for Test: Thyristor Mounting - Question 7

: Pav = (Tj – Ta)/θjA
θjA = (θjc + θcs + θsA).

Test: Thyristor Mounting - Question 8

 Heat dissipation from heat sink mainly takes place by

Detailed Solution for Test: Thyristor Mounting - Question 8

Heat DISSIPATION (rejection of heat to the atmosphere) takes place through convention only.

Test: Thyristor Mounting - Question 9

For low power SCRs (about 1 Ampere current) _____________ type of mounting is used

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Lead mounting is a very simple time of mounting used for low power devices.

Test: Thyristor Mounting - Question 10

In the ___________ type of mounting the SCR is pressed between two heat sinks

Detailed Solution for Test: Thyristor Mounting - Question 10

 In the press-pak type the device is pressed or clamped between two heat-sinks & external pressure is applied from both the sides.

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