Test: Design Processes - Electrical Engineering (EE) MCQ

MIcropocessor has four major architectural blocks – ALU, control unit, I/O unit and memory.

High level of system integration usually greatly reduces interconnections which is a weak spot in any system.

Lower power dissipation, lower weight, lower volume are some of the important features of system.

 Performance is better if power speed product is high. Performance is analysed using this speed power product.

VLSI design is done in top-down manner with adequate computer aided tools to do the job. Partitioning, generating or building and verification is done.

Components operating in high frequency should be at physically proximate, since one may pay severe penalties for long, high bandwidth interconnects.

Several approaches used for design process are conventional circuit symbols, logic symbols, stick diagrams, mask layouts, architectural block diagrams and floor plans.

Floor plan is used to show the planned relative disposition of the subunits on the chip and thus on mask layouts.

When and where ever the polysilicon crosses the diffusion, transistor will be formed.

The first metal layer can be joined with the second one using via. Via is an electrical connection between layers in a physical electronic circuit.