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Test: Structural of Metals & Alloys - 1


10 Questions MCQ Test Engineering Materials | Test: Structural of Metals & Alloys - 1


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This mock test of Test: Structural of Metals & Alloys - 1 for Mechanical Engineering helps you for every Mechanical Engineering entrance exam. This contains 10 Multiple Choice Questions for Mechanical Engineering Test: Structural of Metals & Alloys - 1 (mcq) to study with solutions a complete question bank. The solved questions answers in this Test: Structural of Metals & Alloys - 1 quiz give you a good mix of easy questions and tough questions. Mechanical Engineering students definitely take this Test: Structural of Metals & Alloys - 1 exercise for a better result in the exam. You can find other Test: Structural of Metals & Alloys - 1 extra questions, long questions & short questions for Mechanical Engineering on EduRev as well by searching above.
QUESTION: 1

An example of amorphous material is  

Solution:

Amorphous material is one in which there is no definite atomic structure and atom exist in a random pattern just as in a liquid.

QUESTION: 2

The crystal structure of brass is

Solution:
QUESTION: 3

Which is false statement about properties of aluminium?

Solution:
QUESTION: 4

Crystal structure of metals is studied by
Solution:
QUESTION: 5

In structure, all metals are
Solution:
QUESTION: 6

Dislocation in a material is a _____ defect.
Solution:

Line imperfections are known as dislocations.

QUESTION: 7

The co-ordination number of BCC crystal structure is
Solution:

QUESTION: 8

What is the volume of an FCC cell in terms of the atomic radius R?
Solution:


From the right angle on the face,
a2 + a2 = (4 R)2
∴ 2 a2 = 16 R2
∴ 
Volume of FCC unit,

 

QUESTION: 9

The ratio of long and short unit cell dimensions of ideal HCP crystal structure should be
Solution:

For the ideal HCP packing, the ratio of c/a is  i.e. 1.633. The actual HCP metals deviate from ideal c/a ratio.

QUESTION: 10

Which of the following is structure sensitive property?
Solution:

Structure sensitive properties: Electrical conductivity, semiconductor properties, yield stress, fracture strength, creep strength.

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