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Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences | Physics for IIT JAM, UGC - NET, CSIR NET PDF Download

heterojunction is the interface that occurs between two layers or regions of dissimilar crystalline semiconductors. These semiconducting materials have unequal band gaps as opposed to a homojunction. It is often advantageous to engineer the electronic energy bands in many solid-state device applications, including semiconductor lasers, solar cells and transistors ("heterotransistors") to name a few. The combination of multiple heterojunctions together in a device is called a heterostructure, although the two terms are commonly used interchangeably. The requirement that each material be a semiconductor with unequal band gaps is somewhat loose, especially on small length scales, where electronic properties depend on spatial properties. A more modern definition of heterojunction is the interface between any two solid-state materials, including crystalline and amorphous structures of metallic, insulating, fast ion conductor and semiconducting materials.

In 2000, the Nobel Prize in physics was awarded jointly to Herbert Kroemer (University of California, Santa Barbara, California, USA) and Zhores I. Alferov (Ioffe Institute, Saint Petersburg, Russia) for "developing semiconductor heterostructures used in high-speed- and opto-electronics".

 

Manufacture and applications 

Heterojunction manufacturing generally requires the use of molecular beam epitaxy (MBE) or chemical vapor deposition (CVD) technologies in order to precisely control the deposition thickness and create a cleanly lattice-matched abrupt interface.

Despite their expense, heterojunctions have found use in a variety of specialized applications where their unique characteristics are critical:

  • Lasers: Using heterojunctions in lasers was first proposed[2] in 1963 when Herbert Kroemer, a prominent scientist in this field, suggested that population inversion could be greatly enhanced by heterostructures. By incorporating a smaller direct band gap material like GaAs between two larger band gap layers like AlAs, carriers can be confined so that lasing can occur at room temperature with low threshold currents. It took many years for the material science of heterostructure fabrication to catch up with Kroemer's ideas but now it is the industry standard. It was later discovered that the band gap could be controlled by taking advantage of the quantum size effects in quantum well heterostructures. Furthermore, heterostructures can be used as waveguides to the index step which occurs at the interface, another major advantage to their use in semiconductor lasers. Semiconductor diode lasers used in CD and DVD players and fiber optic transceivers are manufactured using alternating layers of various III-V and II-VI compound semiconductors to form lasing heterostructures.

  • Bipolar transistors: When a heterojunction is used as the base-emitter junction of a bipolar junction transistor, extremely high forward gain and low reverse gain result. This translates into very good high frequency operation (values in tens to hundreds of GHz) and low leakage currents. This device is called a heterojunction bipolar transistor (HBT).

  • Field effect transistors: Heterojunctions are used in high electron mobility transistors (HEMT) which can operate at significantly higher frequencies (over 500 GHz). The proper doping profile and band alignment gives rise to extremely high electron mobilities by creating a two dimensional electron gas within a dopant free region where very little scattering can occur.

 

Energy band alignment

Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences | Physics for IIT JAM, UGC - NET, CSIR NET

Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences | Physics for IIT JAM, UGC - NET, CSIR NET

The behaviour of a semiconductor junction depends crucially on the alignment of the energy bands at the interface. Semiconductor interfaces can be organized into three types of heterojunctions: straddling gap (type I), staggered gap (type II) or broken gap (type III) as seen in the figure. Away from the junction, the band bending can be computed based on the usual procedure of solving Poisson's equation.

Various models exist to predict the band alignment.

  • The simplest (and least accurate) model is Anderson's rule, which predicts the band alignment based on the properties of vacuum-semiconductor interfaces (in particular the vacuum electron affinity). The main limitation is its neglect of chemical bonding.

  • A common anion rule was proposed which guesses that since the valence band is related to anionic states, materials with the same anions should have very small valence band offsets. This however did not explain the data but is related to the trend that two materials with different anions tend to have larger valence band offsets than conduction band offsets.

  • Tersoff[ proposed a gap state model based on more familiar metal-semiconductor junctions where the conduction band offset is given by the difference in Schottky barrier height. This model includes a dipole layer at the interface between the two semiconductors which arises from electron tunneling from the conduction band of one material into the gap of the other (analogous to metal-induced gap states). This model agrees well with systems where both materials are closely lattice matched such as GaAs/AlGaAs.

  • The 60:40 rule is a heuristic for the specific case of junctions between the semiconductor GaAs and the alloy semiconductor AlxGa1−xAs. As the x in the AlxGa1−xAs side is varied from 0 to 1, the ratio Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences | Physics for IIT JAM, UGC - NET, CSIR NET  tends to maintain the value 60/40. For comparison, Anderson's rule predicts Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences | Physics for IIT JAM, UGC - NET, CSIR NET  for a GaAs/AlAs junction (x=1).

The typical method for measuring band offsets is by calculating them from measuring exciton energies in the luminescence spectra.

The document Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences | Physics for IIT JAM, UGC - NET, CSIR NET is a part of the Physics Course Physics for IIT JAM, UGC - NET, CSIR NET.
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FAQs on Heterojunction Devices - Semiconductor Devices, CSIR-NET Physical Sciences - Physics for IIT JAM, UGC - NET, CSIR NET

1. What are heterojunction devices in semiconductor physics?
Ans. Heterojunction devices are semiconductor devices that are formed by joining two different types of semiconductors together. The junction between these two materials allows for unique properties and improved device performance, such as enhanced electron mobility and reduced leakage current.
2. How do heterojunction devices differ from homojunction devices?
Ans. Heterojunction devices differ from homojunction devices in that they are formed by joining two different types of semiconductors, while homojunction devices are formed by joining the same type of semiconductor. This difference in material composition leads to variations in bandgap, carrier mobility, and other properties, enabling heterojunction devices to exhibit superior performance in certain applications.
3. What are some advantages of using heterojunction devices?
Ans. Heterojunction devices offer several advantages over homojunction devices. They can provide better performance in terms of high-speed operation, low power consumption, and improved efficiency. Heterojunction devices also allow for better control over the flow of electrons and holes, resulting in reduced leakage current and enhanced device reliability.
4. What are some common applications of heterojunction devices?
Ans. Heterojunction devices find applications in various fields, including optoelectronics, telecommunications, and high-frequency electronics. They are commonly used in light-emitting diodes (LEDs), laser diodes, solar cells, and transistors. Heterojunction devices are also utilized in advanced integrated circuits and sensors due to their superior performance characteristics.
5. How are heterojunction devices fabricated?
Ans. Heterojunction devices are fabricated through various techniques, including molecular beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD). These methods involve depositing thin layers of different semiconductors on a substrate, forming the heterojunction interface. The precise control of layer thickness and composition is crucial to achieve the desired device characteristics and performance.
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