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What is a surface imperfection, which separates crystals of different orientationsin a poly-crystalline aggregate, called? [IES-2008]
  • a)
    Edge dislocation
  • b)
    Stacking fault
  • c)
    Grain boundary
  • d)
    Screw dislocation
Correct answer is option 'C'. Can you explain this answer?
Verified Answer
What is a surface imperfection, which separates crystals of different ...
Ans. (c) There are several types of planar (or surface) defects that occur from a change in the orientation of crystallographic planes across a surface boundary. The most important planar defect is the grain boundary, which is the imperfect plane surface that separates two crystals of different orientation in a polycrystalline solid. Grain boundaries originate when the last few remaining atoms of a liquid freeze onto the meeting faces of two adjacent crystals that have grown from the melt or, similarly, when two adjacent crystals that grow
by re-crystallization meet each other.
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Most Upvoted Answer
What is a surface imperfection, which separates crystals of different ...
Grain Boundary

A grain boundary is a surface imperfection that separates crystals of different orientations in a polycrystalline aggregate. It is the answer to the given question. Grain boundaries are important features in materials science and engineering as they significantly influence the mechanical and electrical properties of materials.

Definition:
Grain boundaries are the interfaces between adjacent crystal grains, which have different crystallographic orientations. They are formed during the solidification process or as a result of mechanical deformation. Grain boundaries can be characterized by their misorientation angle, which is the angular difference in orientation between the adjacent grains.

Types of Grain Boundaries:

1. Low-Angle Grain Boundaries:
These boundaries have a small misorientation angle, typically less than 10 degrees. They are formed during the recrystallization process or as a result of grain growth. Low-angle grain boundaries have a regular atomic arrangement and can act as barriers to dislocation motion, affecting the mechanical properties of the material.

2. High-Angle Grain Boundaries:
These boundaries have a large misorientation angle, typically greater than 10 degrees. They are formed during the solidification process or as a result of severe plastic deformation. High-angle grain boundaries have a more irregular atomic arrangement and can significantly affect the electrical conductivity, diffusion rates, and mechanical properties of the material.

Properties and Effects of Grain Boundaries:

1. Mechanical Properties:
Grain boundaries can act as obstacles to the movement of dislocations, which are line defects in the crystal structure. This impedes plastic deformation and increases the material's strength and hardness. However, grain boundaries can also act as sites for crack initiation and propagation, leading to reduced ductility and fracture toughness.

2. Electrical Properties:
Grain boundaries can impede the flow of electrons, leading to increased electrical resistivity. This property is important in materials used for electrical conductors, where low resistivity is desired. Grain boundaries also affect the performance of semiconductor devices by influencing carrier mobility and recombination rates.

3. Corrosion Resistance:
Grain boundaries can be more susceptible to corrosion compared to the bulk material. This is because the irregular atomic arrangement at the grain boundary provides sites for preferential attack by corrosive species.

Conclusion:

Grain boundaries are surface imperfections that separate crystals of different orientations in a polycrystalline aggregate. They have significant effects on the mechanical, electrical, and corrosion properties of materials. Understanding and controlling grain boundaries is crucial for optimizing the performance of materials in various engineering applications.
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What is a surface imperfection, which separates crystals of different orientationsin a poly-crystalline aggregate, called? [IES-2008]a)Edge dislocationb)Stacking faultc)Grain boundaryd)Screw dislocationCorrect answer is option 'C'. Can you explain this answer?
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