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The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :
- a)Linear increase for Cu, linear increase for Si
- b)Liner increase for Cu, exponential increase for Si
- c)Linear increase for Cu, exponential decrease for Si
- d)Linear decrease for Cu, linear decrease for Si
Correct answer is option 'C'. Can you explain this answer?
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Temperature Dependence of Resistances of Cu and undoped Si
The temperature dependence of resistances of materials is an important aspect to understand their electrical behavior. In the given scenario, we are comparing the temperature dependence of resistances of copper (Cu) and undoped silicon (Si) in the temperature range of 300-400 K.
Explanation:
To analyze the temperature dependence of resistances, we need to consider the behavior of the resistivity of the materials with temperature. The resistivity of a material is defined as the ratio of the electric field applied across it to the current flowing through it.
When it comes to temperature dependence, there are two common trends observed:
1. Linear Increase:
In some materials, the resistivity increases linearly with temperature. This means that as the temperature increases, the resistivity also increases at a constant rate. This behavior is observed in metals like copper (Cu).
2. Exponential Increase/Decrease:
In other materials, the resistivity follows an exponential relationship with temperature. This means that as the temperature increases, the resistivity increases or decreases exponentially. This behavior is observed in semiconductors like undoped silicon (Si).
Comparison between Cu and Si:
Based on the given options, the best description of the temperature dependence of resistances for Cu and Si in the temperature range of 300-400 K is option 'C' - Linear increase for Cu, exponential decrease for Si.
Reasoning:
- Copper (Cu): Copper is a metal, and metals generally exhibit a linear increase in resistivity with temperature. As the temperature increases, the lattice vibrations and collisions of free electrons with lattice defects increase, leading to an increase in resistivity. Therefore, the resistivity of copper (and hence resistance) increases linearly with temperature.
- Undoped Silicon (Si): Silicon is a semiconductor, and semiconductors exhibit an exponential decrease in resistivity with temperature. This is because as the temperature increases, more electrons are excited from the valence band to the conduction band, increasing the conductivity. This behavior is opposite to that of metals and leads to a decrease in resistivity (and hence resistance) with temperature.
Therefore, the temperature dependence of resistances of Cu and undoped Si in the temperature range of 300-400 K is best described by linear increase for Cu and exponential decrease for Si (option 'C').
The temperature dependence of resistances of materials is an important aspect to understand their electrical behavior. In the given scenario, we are comparing the temperature dependence of resistances of copper (Cu) and undoped silicon (Si) in the temperature range of 300-400 K.
Explanation:
To analyze the temperature dependence of resistances, we need to consider the behavior of the resistivity of the materials with temperature. The resistivity of a material is defined as the ratio of the electric field applied across it to the current flowing through it.
When it comes to temperature dependence, there are two common trends observed:
1. Linear Increase:
In some materials, the resistivity increases linearly with temperature. This means that as the temperature increases, the resistivity also increases at a constant rate. This behavior is observed in metals like copper (Cu).
2. Exponential Increase/Decrease:
In other materials, the resistivity follows an exponential relationship with temperature. This means that as the temperature increases, the resistivity increases or decreases exponentially. This behavior is observed in semiconductors like undoped silicon (Si).
Comparison between Cu and Si:
Based on the given options, the best description of the temperature dependence of resistances for Cu and Si in the temperature range of 300-400 K is option 'C' - Linear increase for Cu, exponential decrease for Si.
Reasoning:
- Copper (Cu): Copper is a metal, and metals generally exhibit a linear increase in resistivity with temperature. As the temperature increases, the lattice vibrations and collisions of free electrons with lattice defects increase, leading to an increase in resistivity. Therefore, the resistivity of copper (and hence resistance) increases linearly with temperature.
- Undoped Silicon (Si): Silicon is a semiconductor, and semiconductors exhibit an exponential decrease in resistivity with temperature. This is because as the temperature increases, more electrons are excited from the valence band to the conduction band, increasing the conductivity. This behavior is opposite to that of metals and leads to a decrease in resistivity (and hence resistance) with temperature.
Therefore, the temperature dependence of resistances of Cu and undoped Si in the temperature range of 300-400 K is best described by linear increase for Cu and exponential decrease for Si (option 'C').
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The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer?
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The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer? for JEE 2024 is part of JEE preparation. The Question and answers have been prepared according to the JEE exam syllabus. Information about The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer? covers all topics & solutions for JEE 2024 Exam. Find important definitions, questions, meanings, examples, exercises and tests below for The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer?.
The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer? for JEE 2024 is part of JEE preparation. The Question and answers have been prepared according to the JEE exam syllabus. Information about The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer? covers all topics & solutions for JEE 2024 Exam. Find important definitions, questions, meanings, examples, exercises and tests below for The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer?.
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The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer?, a detailed solution for The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer? has been provided alongside types of The temperature dependence of resistances of Cu and undoped Si in the temperature range 300-400 K, is best described by :a)Linear increase for Cu, linear increase for Sib)Liner increase for Cu, exponential increase for Sic)Linear increase for Cu, exponential decrease for Sid)Linear decrease for Cu, linear decrease for SiCorrect answer is option 'C'. Can you explain this answer? theory, EduRev gives you an
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