Silicon oxide is patterned on a substrate using:a)Physical lithography...
Silicon oxide is patterned on a substrate using Photolithography.
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Silicon oxide is patterned on a substrate using:a)Physical lithography...
Photolithography
Photolithography is the process used to pattern silicon oxide on a substrate. This technique involves using light to transfer a geometric pattern from a photomask to a light-sensitive chemical photoresist on the substrate.
Steps in Photolithography process:
- Photoresist coating: A thin layer of photoresist is spin-coated onto the substrate.
- Soft bake: The substrate is heated to remove any solvent from the photoresist, making it more stable.
- Alignment and exposure: The substrate is aligned with a photomask containing the desired pattern, and then exposed to UV light.
- Development: The exposed photoresist is developed using a specific chemical solution, which removes the unexposed regions, leaving behind the pattern.
- Etching: The patterned photoresist acts as a mask for etching the silicon oxide on the substrate.
- Photoresist removal: The remaining photoresist is stripped away, leaving behind the patterned silicon oxide on the substrate.
Advantages of Photolithography:
- High resolution: Photolithography can achieve very fine feature sizes.
- Scalability: It is a highly scalable process suitable for mass production.
- Cost-effective: Photolithography is a cost-effective method for patterning substrates.
In conclusion, photolithography is the preferred method for patterning silicon oxide on a substrate due to its high resolution, scalability, and cost-effectiveness.