Silicon devices are preferred at high temperature operations in compar...
Introduction:
Silicon and germanium are both commonly used materials in the manufacturing of electronic devices. However, when it comes to high temperature operations, silicon is preferred over germanium. One of the reasons for this preference is that the reverse saturation current is less in the case of silicon.
Explanation:
Reverse saturation current, also known as dark current, is the current that flows in the reverse direction across a diode when it is under reverse bias. It is caused by the minority carriers (electrons in p-type material and holes in n-type material) that are thermally generated in the depletion region of the diode.
Less reverse saturation current in silicon:
Silicon has a larger bandgap compared to germanium. The bandgap is the energy difference between the valence band (where electrons are tightly bound to atoms) and the conduction band (where electrons are free to move). In silicon, the bandgap is about 1.1 eV, while in germanium, it is about 0.7 eV.
The larger bandgap of silicon makes it less susceptible to thermal excitation. At high temperatures, more electrons in germanium gain enough energy to jump from the valence band to the conduction band, leading to a higher reverse saturation current. On the other hand, the larger bandgap of silicon restricts the number of thermally generated minority carriers, resulting in a lower reverse saturation current.
Benefits of lower reverse saturation current:
1. Reduced power dissipation: The reverse saturation current contributes to power dissipation in a device. By using silicon devices with lower reverse saturation current, less power is wasted in the form of heat generated by the current.
2. Improved efficiency: With lower reverse saturation current, the device operates more efficiently, as less current is lost due to minority carrier generation.
3. Better temperature stability: The lower reverse saturation current in silicon devices improves their stability at high temperatures. This is particularly important in applications where the device needs to operate reliably in extreme temperature conditions.
Conclusion:
In summary, silicon devices are preferred over germanium devices for high temperature operations because silicon has a lower reverse saturation current. This characteristic of silicon leads to reduced power dissipation, improved efficiency, and better temperature stability, making it a suitable choice for electronic devices operating under extreme temperature conditions.
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