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Why is silicon dioxide (SiO2) layer used in ICs ?
- a)To protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion.
- b)Because if facilitates the penetration of the desired impurity by diffusion
- c)To control the concentration of the diffused impurities.
- d)Because of its high heat conduction
Correct answer is option 'A'. Can you explain this answer?
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Why is silicon dioxide (SiO2) layer used in ICs ?a)To protect the surf...
SiO2 layer is used in ICs primarily for two reasons: to protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion.
1. Protection from external contaminants:
- The SiO2 layer acts as a protective barrier between the surface of the chip and the surrounding environment. It prevents the chip from coming into direct contact with external contaminants such as moisture, dust, and other impurities.
- These contaminants can adversely affect the performance and reliability of the ICs by causing short circuits, corrosion, and other forms of damage.
- The SiO2 layer acts as a barrier against these contaminants, ensuring the longevity and reliability of the ICs.
2. Selective formation of n and p regions by diffusion:
- In the fabrication process of ICs, it is necessary to introduce impurities into the silicon substrate to create specific regions with different electrical properties.
- The SiO2 layer acts as a mask during the diffusion process, allowing for the selective formation of these regions.
- By depositing a layer of SiO2 and then patterning it to expose specific areas of the silicon substrate, impurities can be diffused only into those exposed areas.
- This allows for the precise formation of n-type and p-type regions, which are essential for the operation of transistors and other semiconductor devices on the chip.
Other options explained:
b) The SiO2 layer does not facilitate the penetration of the desired impurity by diffusion. Instead, it acts as a mask to control the diffusion process.
c) While the SiO2 layer does control the concentration of the diffused impurities to some extent, its primary role is to act as a protective layer and allow for selective formation of regions.
d) The SiO2 layer does not have a high heat conduction property. In fact, it is used as an insulator to electrically isolate different components on the chip, preventing heat from dissipating in unwanted areas.
In summary, the SiO2 layer in ICs is primarily used to protect the chip's surface from external contaminants and to allow for the selective formation of n and p regions by diffusion, which is crucial for the proper functioning of semiconductor devices on the chip.
1. Protection from external contaminants:
- The SiO2 layer acts as a protective barrier between the surface of the chip and the surrounding environment. It prevents the chip from coming into direct contact with external contaminants such as moisture, dust, and other impurities.
- These contaminants can adversely affect the performance and reliability of the ICs by causing short circuits, corrosion, and other forms of damage.
- The SiO2 layer acts as a barrier against these contaminants, ensuring the longevity and reliability of the ICs.
2. Selective formation of n and p regions by diffusion:
- In the fabrication process of ICs, it is necessary to introduce impurities into the silicon substrate to create specific regions with different electrical properties.
- The SiO2 layer acts as a mask during the diffusion process, allowing for the selective formation of these regions.
- By depositing a layer of SiO2 and then patterning it to expose specific areas of the silicon substrate, impurities can be diffused only into those exposed areas.
- This allows for the precise formation of n-type and p-type regions, which are essential for the operation of transistors and other semiconductor devices on the chip.
Other options explained:
b) The SiO2 layer does not facilitate the penetration of the desired impurity by diffusion. Instead, it acts as a mask to control the diffusion process.
c) While the SiO2 layer does control the concentration of the diffused impurities to some extent, its primary role is to act as a protective layer and allow for selective formation of regions.
d) The SiO2 layer does not have a high heat conduction property. In fact, it is used as an insulator to electrically isolate different components on the chip, preventing heat from dissipating in unwanted areas.
In summary, the SiO2 layer in ICs is primarily used to protect the chip's surface from external contaminants and to allow for the selective formation of n and p regions by diffusion, which is crucial for the proper functioning of semiconductor devices on the chip.
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Why is silicon dioxide (SiO2) layer used in ICs ?a)To protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion.b)Because if facilitates the penetration of the desired impurity by diffusionc)To control the concentration of the diffused impurities.d)Because of its high heat conductionCorrect answer is option 'A'. Can you explain this answer?
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Why is silicon dioxide (SiO2) layer used in ICs ?a)To protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion.b)Because if facilitates the penetration of the desired impurity by diffusionc)To control the concentration of the diffused impurities.d)Because of its high heat conductionCorrect answer is option 'A'. Can you explain this answer? for Electrical Engineering (EE) 2024 is part of Electrical Engineering (EE) preparation. The Question and answers have been prepared according to the Electrical Engineering (EE) exam syllabus. Information about Why is silicon dioxide (SiO2) layer used in ICs ?a)To protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion.b)Because if facilitates the penetration of the desired impurity by diffusionc)To control the concentration of the diffused impurities.d)Because of its high heat conductionCorrect answer is option 'A'. Can you explain this answer? covers all topics & solutions for Electrical Engineering (EE) 2024 Exam. Find important definitions, questions, meanings, examples, exercises and tests below for Why is silicon dioxide (SiO2) layer used in ICs ?a)To protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion.b)Because if facilitates the penetration of the desired impurity by diffusionc)To control the concentration of the diffused impurities.d)Because of its high heat conductionCorrect answer is option 'A'. Can you explain this answer?.
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