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To effect a bond between two metal plates, 2.5 cm and 15 cm thick, heat is uniformly applied through the thinner plate by a radiant heat source. The bonding must be held at 320 K for a short time. When the heat source is adjusted to have a steady value of 43.5 k W/m2, a thermocouple installed on the side of the thinner plate next to source indicates a temperature of 345 K. Calculate the temperature gradient for heat conduction through thinner plate. In the diagram, the upper plate is 2.5 cm thick while the lower is 15 cm thick.



  • a)
    – 1000 degree Celsius/m

  • b)
    – 2000 degree Celsius/m

  • c)
    – 3000 degree Celsius/m

  • d)
    – 4000 degree Celsius/m

Correct answer is option 'A'. Can you explain this answer?
Verified Answer
To effect a bond between two metal plates, 2.5 cm and 15 cm thick, hea...
Temperature gradient = d t/d x = – 1000 degree Celsius/m. Also, q/A = – k (t2– t 1)/δ.
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To effect a bond between two metal plates, 2.5 cm and 15 cm thick, heat is uniformly applied through the thinner plate by a radiant heat source. The bonding must be held at 320 K for a short time. When the heat source is adjusted to have a steady value of 43.5 k W/m2, a thermocouple installed on the side of the thinner plate next to source indicates a temperature of 345 K. Calculate the temperature gradient for heat conduction through thinner plate. In the diagram, the upper plate is 2.5 cm thick while the lower is 15 cm thick.a)– 1000 degree Celsius/mb)– 2000 degree Celsius/mc)– 3000 degree Celsius/md)– 4000 degree Celsius/mCorrect answer is option 'A'. Can you explain this answer?
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To effect a bond between two metal plates, 2.5 cm and 15 cm thick, heat is uniformly applied through the thinner plate by a radiant heat source. The bonding must be held at 320 K for a short time. When the heat source is adjusted to have a steady value of 43.5 k W/m2, a thermocouple installed on the side of the thinner plate next to source indicates a temperature of 345 K. Calculate the temperature gradient for heat conduction through thinner plate. In the diagram, the upper plate is 2.5 cm thick while the lower is 15 cm thick.a)– 1000 degree Celsius/mb)– 2000 degree Celsius/mc)– 3000 degree Celsius/md)– 4000 degree Celsius/mCorrect answer is option 'A'. Can you explain this answer? for Chemical Engineering 2024 is part of Chemical Engineering preparation. The Question and answers have been prepared according to the Chemical Engineering exam syllabus. Information about To effect a bond between two metal plates, 2.5 cm and 15 cm thick, heat is uniformly applied through the thinner plate by a radiant heat source. The bonding must be held at 320 K for a short time. When the heat source is adjusted to have a steady value of 43.5 k W/m2, a thermocouple installed on the side of the thinner plate next to source indicates a temperature of 345 K. Calculate the temperature gradient for heat conduction through thinner plate. In the diagram, the upper plate is 2.5 cm thick while the lower is 15 cm thick.a)– 1000 degree Celsius/mb)– 2000 degree Celsius/mc)– 3000 degree Celsius/md)– 4000 degree Celsius/mCorrect answer is option 'A'. Can you explain this answer? covers all topics & solutions for Chemical Engineering 2024 Exam. Find important definitions, questions, meanings, examples, exercises and tests below for To effect a bond between two metal plates, 2.5 cm and 15 cm thick, heat is uniformly applied through the thinner plate by a radiant heat source. The bonding must be held at 320 K for a short time. When the heat source is adjusted to have a steady value of 43.5 k W/m2, a thermocouple installed on the side of the thinner plate next to source indicates a temperature of 345 K. Calculate the temperature gradient for heat conduction through thinner plate. In the diagram, the upper plate is 2.5 cm thick while the lower is 15 cm thick.a)– 1000 degree Celsius/mb)– 2000 degree Celsius/mc)– 3000 degree Celsius/md)– 4000 degree Celsius/mCorrect answer is option 'A'. Can you explain this answer?.
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