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The process by which Aluminium is grown over the entire wafer , also filling the contact cuts is:
- a)Sputtering
- b)Chemical vapour deposition
- c)Epitaxial growth
- d)Ion Implantation
Correct answer is option 'A'. Can you explain this answer?
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The process by which Aluminium is grown over the entire wafer , also f...
Aluminum is sputtered over the entire wafer, it also fills the contact cuts
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The process by which Aluminium is grown over the entire wafer , also f...
Sputtering for Growing Aluminium on a Wafer
Sputtering is the process used to grow Aluminium over the entire wafer and fill the contact cuts. Here's how it works:
Process Explanation:
- In sputtering, a target material (in this case, Aluminium) is bombarded with high-energy particles, causing atoms to be ejected from the target surface.
- These ejected Aluminium atoms then deposit onto the wafer surface, creating a thin film of Aluminium.
- The sputtering process allows for precise control over the thickness and uniformity of the deposited Aluminium layer.
Filling Contact Cuts:
- Sputtering is particularly effective for filling contact cuts on the wafer because it allows for conformal deposition, ensuring that the Aluminium completely covers the contact cuts.
- This results in good electrical contact between the Aluminium film and the underlying layers on the wafer.
Advantages of Sputtering:
- Sputtering is a widely used technique in the semiconductor industry due to its ability to deposit thin films with high purity and uniformity.
- It is a versatile process that can be used for a variety of materials, including Aluminium.
In conclusion, sputtering is the preferred method for growing Aluminium on a wafer and filling contact cuts due to its precision, uniformity, and effectiveness in creating good electrical contacts.
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The process by which Aluminium is grown over the entire wafer , also f...
The process of deposition of thin film of various materials is called sputtering.
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The process by which Aluminium is grown over the entire wafer , also filling the contact cuts is:a)Sputteringb)Chemical vapour depositionc)Epitaxial growthd)Ion ImplantationCorrect answer is option 'A'. Can you explain this answer?
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